Feature Analysis

Level 1: External visual inspection

PCB and external component inspection

We detect burn marks, fractures, discoloration, and any signs of overheating or localized electrical failure.

Solder joint stress testing

We evaluate solder thickening or cracking caused by mechanical stress that could compromise reliability.

Delamination detection

Through optical and acoustic inspection, we locate internal separations between the molding compound and the substrate.

X-ray inspection

We check internal connections, solder joints, and possible shorts or discontinuities.

Optical and digital microscopy

We analyze surfaces at high magnification to reveal microdefects invisible to the naked eye.

Infrared thermography

We detect hot spots that indicate electrical leakage or overloading.

Chemical or mechanical decapsulation

We remove the package to expose the silicon die.

Scanning Electron Microscopy (SEM)

We study microscopic details such as fractures in tracks, metal migration, or contamination.

Energy Dispersive X-ray Spectroscopy (EDS/EDX)

We determine the chemical composition of residues or contaminants that caused the failure.

Ensure the reliability and performance of your electronic components with our professional Semiconductor services.

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